Cranston, Rhode Island USA – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation at SMTconnect, scheduled to take place on May 10- 12th at the NürnbergMesse Exhibition Center in Nüremberg, Germany. AIM will highlight V9, their new ultra low-voiding, no clean paste, along with their full line of solder assembly materials.
Formulated to solve one of the industry’s most difficult challenges, V9 has proven to reduce voiding to as low as 1% on BGA and <5% on BTC components while exhibiting stable print performance on fine feature devices over 12 hours. V9 post-process residue is easily probed and possesses high SIR values required for high reliability applications.
AIM will also highlight its REL22™ and REL61™ alloys and NC273LT low temperature solder paste. When thermal exposure during the assembly process is a limitation, NC273LT is an excellent RoHS compliant replacement. AIM’s REL22™ improves product survival in extreme thermal exposure operating environments such as under-hood automotive, avionics/aerospace and LED lighting. REL61™ is ideally suited for industries which require a cost-effective alternative to SAC305 with no loss of processing performance or durability.
To discover all of AIM’s products and services, visit AIM at SMTconnect in Hall 4 Stand 330 at the NürnbergMesse Exhibition Center, Nüremberg, Germany for more information and to speak with one of AIM’s knowledgeable staff members.
