AIM Solder to Highlight New LUX Product Line at Hangjianet MiniLED Conference

Cranston, Rhode Island USA – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that they will feature their new AIM LUX™ Product Line at Hangjiatalk MiniLED, scheduled to take place on November 17th and 18th, 2022, at Crowne Plaza Shenzhen International Convention and Exhibition Center.

AIM designed its LUX solder materials to provide tier one manufacturers of LED, miniLED and hi-power LED assemblies with solder pastes and alloys to solve production challenges associated with these applications. AIM Solder’s Flopy Feng will present on the second day on MiniLED Assembly Material Considerations.

Designed to provide tier one manufacturers of LED, miniLED and hi-power LED assemblies with solder materials to solve production challenges associated with these applications, the LUX product line pairs ultra-fine SAC-based and silver-free Type 6, 7 and 8 alloy powders along with innovative flux chemistries.  AIM’s NC259 series is proven to provide excellent soldering performance and high production yields.  When combined with the SN100C® alloy, NC259 solder pastes eliminate silver migration concerns.  AIM REL61™ is a low-silver alloy option that can lower peak reflow temperature requirements and improve mechanical strength over other low/no-silver alloys.  For high-power LEDs, AIM's REL22™ doubles the service life under extreme thermal cycling conditions.  AIM's Tacky Flux offers high tack forces, unlimited open time, and improved wetting for all mass transfer and high-speed dipping applications.

AIM Solder’s Flopy Feng will also present information on MiniLED Assembly Material Considerations on November 18th.  MiniLED assemblers can learn from SMT applications because they share some similarities, but as technology progresses, it is apparent there are significant differences as well.  Ultra-miniature print requirements, novel component placement techniques and low oxygen reflow environments require new and innovative materials to optimize production throughput and product quality. This presentation will discuss some of the material considerations for miniLED assembly and their implementation.

For more information about the AIM LUX Product Line and AIM’s services, visit us at Hangjiatalk MiniLED or visit www.aimsolder.com.

 

About AIM
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service, and training. For more information about AIM’s complete line of advanced solder products and global technical services, please visit www.aimsolder.com.