Cranston, Rhode Island USA ― AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Flopy Feng will present at the 2021 Hangjiatalk MiniLED Backlight Application Analysis Forum at JW Marriott® Hotel Shenzhen Bao'an in Shenzhen, China.Flopy’s presentation, “Mini/MicroLED Assembly Interconnect Challenges and Solutions” is scheduled for Tuesday, August 3rd, 2021 from 11:25-11:55.
The Mini/MicroLED market is poised to experience exponential growth over the next 2-3 years. AIM is currently one of the largest suppliers of solder alloy and flux chemistry to the MiniLED industry. AIM’s presentation will detail the challenges in producing MiniLED assemblies and provide information about how AIM products are being used to address the unique requirements of current and future applications.
To discover more about AIM’s LUX LED Products, visit www.aimsolder.com.
About the Presenter
Flopy Feng is an Award-Winning Presenter and Technical Support Manager for AIM Solder. Having worked as a process supervisor for many years, he is experienced in process evaluation and optimization. With over 20 years’ of experience in the SMT industry, Flopy supports AIM customers in south China.
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, visit www.aimsolder.com.
