August 09, 2010
AIM is pleased to announce the release of NC265LR, an alcohol-based no-clean liquid flux formulated to offer low-residue and excellent wetting for lead-free and tin-lead wave soldering applications.
March 11, 2009
Highly Active Flux For Wave Soldering
December 03, 2007
AIM is pleased to announce the development of One-Step Underfill 688, a non-odorous, low surface tension, reworkable one component epoxy resin designed as a one-step underfill for flip chip, CSP, BGA and µBGA assemblies.
May 01, 2007
AIM is pleased to announce the development of NC257 lead-free no-clean solder paste, designed to improve the throughput and increase the efficiency of the most advanced SMT applications.
October 19, 2004
AIM has introduced 270WR, a VOC-free, no-clean liquid flux formulated to offer a broad process window for lead-free and tin-lead wave soldering applications.
December 10, 2003
AIM's Lead-Free Solder Starter Kit allows manufacturers to experiment with lead-free solder materials without having to purchase large quantities of several products.
June 06, 2003
NC254 is an all-purpose lead-free, pin probe testable no-clean solder paste formulated to perform well in virtually any SMT application. NC254 offers broad process windows for printing, reflow, and pin probe testing.
June 06, 2003
NC298 is a no-clean solder paste designed to be a workhorse for even the most challenging SMT applications.
October 17, 2001
Extremely Broad Process Window for Assembly and Testing, Reduces Common Solder Defects
October 16, 2001
Fast Flow, Reworkable Underfill for CSPs and Flip Chips