In order to provide the electronics assembly industry with a viable cost-effective lead-free alloy, AIM has developed LF218™, a ternary alloy comprised of 96.5% tin, 3% silver and 0.5 % copper. LF218™ is in line with the JEIDA recommendation for lead-free alloys.
LF218™ is a part of the tin/silver/copper family of alloys, which has been deemed the most viable lead-free alternatives by industry consortia, organizations, and manufacturers. Thus, LF218™ offers all of the advantages found in the tin/silver/copper family of alloys, including excellent thermal and mechanical reliability, a relatively low melting temperature (217-218°C), compatibility with existing parts and processes, and wide availability.
In addition to the above, LF218™ offers several advantages within the tin/silver/copper family. Because the alloy contains the lowest silver content of any tin-silver-copper alloy, LF218™ is the most cost-effective alloy in this family and offers the closest price to tin/lead alloys. In addition, this low silver content results in the best wetting of any tin/silver/copper alloy, which is of critical importance in the transition to lead-free soldering. Furthermore, LF218™ is patent-free and therefore is widely available.
Headquartered in Montreal, Canada, AIM is a leading global manufacturer of assembly materials for the electronics industry. The company produces solder paste, liquid flux, cored wire, bar solder, adhesives, preforms and specialty alloys such as indium and gold for the electronics assembly, PC fabrication, component manufacturing and other industries. AIM may be contacted at firstname.lastname@example.org.