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AIM is a leading global manufacturer of tin-lead and lead-free solder assembly materials for the electronics industry.

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AIM's product line includes a full range of solder products and a wide variety of lead-free solder alloys.

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Cranston, Rhode Island, USA- AIM is pleased to announce the development of NC258 No Clean Solder Paste, designed to offer one of the longest pause-to-print windows in the industry while enhancing fine print definitions.

In addition to its best-in-class printing capabilities, NC258 has proven to reduce voiding and head-in-pillow, thereby reducing rework and rejected board costs to the manufacturer. The superior wetting ability of NC258 results in bright, smooth and shiny solder joints.  NC258 offers very low post process residues, which remain crystal clear after soldering.

NC258 is halogen-free to Oxygen Bomb EN 14582:2007 SW 9056 SW 5050 and halide-free to IPC J-STD-004.  NC258 No Clean Solder Paste is best used within 9 months when stored at 4°C – 12°C (40°F - 55°F) or 4 months at room temperature and is available in a wide variety of packaging.  

Headquartered in Montreal, Canada, AIM is a leading global manufacturer of assembly materials for the electronics industry.  The company produces solder paste, liquid flux, cored wire, bar solder, adhesives, preforms, and specialty alloys such as indium and gold for electronics assembly, PC fabrication, component manufacturing and other industries. For more information, visit AIM on the web at www.aimsolder.com, or contact us through email at info@aimsolder.com.

Posted in: Press Room

NEW NC258 NO CLEAN SOLDER PASTE

Solving the Most Challenging Lead-Free Application Problems

SN100C®

SN100C® offers high-throughput and the lowest cost of ownership as compared to any other lead-free solder alloy. Also available in paste form.

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