CRANSTON, RI ― September 22, 2011 ― AIM, a leading global manufacturer of solder assembly materials for electronics assembly, PC fabrication, component manufacturing and other industries, will showcase its NC258 Lead-Free and Tin-Lead Solder Paste in Booth #526 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.
AIM’s most robust solder paste, NC258, has been developed to offer long pause-to-print capabilities while enhancing fine print definitions. NC258 Solder Paste reduces defects such as voiding and head-in-pillow. The superior wetting ability of NC258 results in bright, smooth and shiny solder joints. Additionally, the paste offers very low post-process residues that remain crystal clear even at the elevated temperatures required for today's lead-free alloys.
Additionally, the company will highlight SN100C® and its wide variety of flux types and solder alloys, including lead-free alloys. SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium.
For more information, meet company representatives in Booth #526 at the show or visit www.aimsolder.com
Headquartered in Montreal, Canada, AIM is a leading global manufacturer of assembly materials for the electronics industry. The company produces solder paste, liquid flux, cored wire, bar solder, adhesives, preforms, and specialty alloys such as indium and gold for electronics assembly, PC fabrication, component manufacturing and other industries. For more information, visit AIM on the Web at www.aimsolder.com, or e-mail email@example.com.