AIM is pleased to announce the release of 212 solder paste, a resin/rosin based, no clean paste designed to be used in an exceptionally broad range of SMT processes. 212 is a halide-activated paste which has proven to have excellent wetting capabilities, even when used on difficult-to-solder surfaces. In addition, the post-process residues of 212 pass IPC cleanliness testing, and thus are safe to be left uncleaned on most assemblies.
212 has proven to work well in continuous-run and start-and-stop batch printing operations. Users of 212 will benefit from up to 72 hours of tack time and up to 8 hours of stencil life. In addition, 212 has proven to be slump resistant during high-speed printing and offers excellent printing characteristics. 212 also offers the high tack force necessary for today’s high-speed placement equipment. Furthermore, 212 has proven to offer exceptional heat and humidity tolerances, allowing it to be used in a broad range of environments.
212 may be reflowed in air or nitrogen, has a one year refrigerated shelf life, and may be cleaned with saponified water. 212 is available in a wide variety of alloys, powder mesh sizes, and all conventional packaging.