SOLDER plus SUPPORT

AIM is a leading global manufacturer of tin-lead and lead-free solder assembly materials for the electronics industry.

COMPLETE PRODUCT LINE

AIM's product line includes a full range of solder products and a wide variety of lead-free solder alloys.

Product Releases

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Product Releases

 

AIM Introduces NC265LR Liquid Flux

August 09, 2010

AIM is pleased to announce the release of NC265LR, an alcohol-based no-clean liquid flux formulated to offer low-residue and excellent wetting for lead-free and tin-lead wave soldering applications.

Posted in: Product Releases

WS735 Water Soluble Liquid Flux

March 11, 2009

Highly Active Flux For Wave Soldering

Posted in: Product Releases

AIM Announces One-Step Underfill 688

December 03, 2007

AIM is pleased to announce the development of One-Step Underfill 688, a non-odorous, low surface tension, reworkable one component epoxy resin designed as a one-step underfill for flip chip, CSP, BGA and µBGA assemblies.

Posted in: Product Releases

AIM Announces Low-Voiding NC257 Lead-Free No-Clean Solder Paste

May 01, 2007

AIM is pleased to announce the development of NC257 lead-free no-clean solder paste, designed to improve the throughput and increase the efficiency of the most advanced SMT applications.

Posted in: Product Releases

270WR VOC-Free Lead-Free Compatible Wave Solder Flux

October 19, 2004

AIM has introduced 270WR, a VOC-free, no-clean liquid flux formulated to offer a broad process window for lead-free and tin-lead wave soldering applications.

Posted in: Product Releases

Lead-Free Solder Starter Kit

December 10, 2003

AIM's Lead-Free Solder Starter Kit allows manufacturers to experiment with lead-free solder materials without having to purchase large quantities of several products.

Posted in: Product Releases

NC254 Lead-Free Pin Probe Testable No-Clean Solder Paste

June 06, 2003

NC254 is an all-purpose lead-free, pin probe testable no-clean solder paste formulated to perform well in virtually any SMT application. NC254 offers broad process windows for printing, reflow, and pin probe testing.

Posted in: Product Releases

NC298 No-Clean Solder Paste

June 06, 2003

NC298 is a no-clean solder paste designed to be a workhorse for even the most challenging SMT applications.

Posted in: Product Releases

253 Pin Probe Testable No-Clean Solder Paste

October 17, 2001

Extremely Broad Process Window for Assembly and Testing, Reduces Common Solder Defects

Posted in: Product Releases

Underfill 620

October 16, 2001

Fast Flow, Reworkable Underfill for CSPs and Flip Chips

Posted in: Product Releases
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NEW NC259 no clean solder paste!

NC259 is a low-cost, lead-free halogen-free solder paste that offers the performance of tin-lead and high-silver lead-free solder pastes.  Now manufacturers can attain the SMT soldering results they require and pay significantly less per gram than with traditional lead-free solder pastes.     

SN100C®

SN100C® offers high-throughput and the lowest cost of ownership as compared to any other lead-free solder alloy. Also available in paste form.

LEAD-FREE

AIM can help you to make the transition to lead-free soldering.

AIM products and process knowledge can help your company to go lead-free logically and economically.

Support

Improve throughput, prevent defects and implement the latest assembly technologies.

Improve the efficiency and profitability of your manufacturing processes with AIM.

AIM Divisions

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