AIM is a leading global manufacturer of tin-lead and lead-free solder assembly materials for the electronics industry.
AIM's product line includes a full range of solder products and a wide variety of lead-free solder alloys.
A non-odorous, low surface tension, one component epoxy resin designed as a one-step underfill for flip chip, CSP, BGA and uBGA assemblies.
The following features are associated with this product:
AIM offers a wide variety of flux types and solder alloys, including lead-free alloys. If you cannot find the product you are looking for, please send us a request. You may also visit our Technical Data Sheet page for a more extensive list of product data sheets.
Solving the Most Challenging Lead-Free Application Problems
SN100C® offers high-throughput and the lowest cost of ownership as compared to any other lead-free solder alloy. Also available in paste form.
AIM can help you to make the transition to lead-free soldering.
AIM products and process knowledge can help your company to go lead-free logically and economically.
Improve throughput, prevent defects and implement the latest assembly technologies.
Improve the efficiency and profitability of your manufacturing processes with AIM.