Sn63/Pb37 Electropure™ is a high purity alloy that is composed of 63% tin and 37% lead. Electropure is alloyed in a proprietary method that results in a low drossing, high wetting solder. The Electropure process reduces suspended oxides in the solder, thus reducing drossing, improving flow,...
Best choice for lead-free wave soldering SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of...
A single component, epoxy adhesive used for bonding SMT components to a PWB for double sided reflow or wave solder assembly.
NC259 is a low-cost, lead-free halogen-free solder paste that offers the performance of tin-lead and high-silver lead-free solder pastes. Now manufacturers can attain the SMT soldering results they require and pay significantly less per gram than with traditional lead-free solder pastes....
A saponifier formulated to readily remove resin, rosin, no clean, and water soluble flux residues from printed circuit boards while preventing the attack of aluminum components and hardware common with many saponifers.
Epoxy 4089 is a single component, epoxy adhesive used for bonding SMT components to a PWB for double sided reflow or wave solder assembly. Epoxy 4089 has a formulated tolerance to shear-thinning, a dot formation suitable for automated dispense equipment or positive displacement pump systems, and...
A saponifier formulated to readily remove resin, rosin, no clean and water soluble flux residues from printed circuit boards, while preventing the attack of aluminum components and hardware common with many saponifers.
A long chained alcohol based stencil cleaner with a concentrated additive that is 100% compatible with all AIM solder pastes.
NC257-2 Lead-Free Solder Paste improves every aspect of lead-free soldering, increasing the throughput of the most advanced SMT applications. NC257-2 Lead-Free Solder Paste offers excellent wetting ability. AND the thermal stability of NC257-2 Lead-Free Solder Paste has proven to eliminate the most...
A non-odorous, low surface tension, one component epoxy resin designed as a one-step underfill for flip chip, CSP, BGA and uBGA assemblies. Available in industry standard sizes.
A solvent blend stencil cleaner with a concentrated additive that is 100% compatible with all AIM solder pastes and epoxies.
NC254 is a lead-free and tin-lead compatible solder paste that offers very good wetting, clear residues and has shown to eliminate voiding under micro-BGAs.
GLOW CORE is a lead-free and tin-lead compatible no-clean flux core that offers very good wetting and low residues.
A medium solids, mildly activated liquid flux with a solvent rosin activation formulated to provide a post-process flux residue that is both insulating and non-hydroscopic and does not require cleaning.
NC217 Gel Flux is designed for touch-up and repair work where the flux may spread away from the heat source. NC217 Gel Flux is electrically safe even without a thermal profile. this gel flux dries within one hour of use with or without heat and is tack-free after four hours.
WS770 is a PH neutral, organically activated, water-based, VOC-free water-soluble liquid flux formulated to fully atomize during the wave soldering process.
AIM’s WS488 water soluble solder paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates. WS488 offers superior slump resistance, as well as excellent print characteristics and 8+ hours of stencil life. WS488 is compatible with all...
WS730 is a water-based, high activity liquid flux designed to offer low-spattering and excellent wetting, even to difficult-to-solder parts.
An alcohol based water soluble liquid flux that offers excellent wetting and ease-of-cleaning.
IPA-based flux for foaming or spraying applications.
A mildly activated, general-purpose wire solder for use in applications requiring good activation.
OAJ Cored Wire features a halide activated system that has been neutralized with an amine. The aminehydrohalide provides a high activation level that produces excellent tarnish or oxide removal, and maximum capillary action, leading to faster wetting, and reducing the chances of thermal degradation...
AIM WS Paste Flux is a water washable tacky/rework flux designed to wet virtually all solderable electronic surfaces, components, assemblies, and substrates. AIM WS Paste Flux may be used for general touch up or rework of printed circuit boards, and for attaching spheres to ball grid array (BGA)...
A fully activated, general-purpose wire solder for use in applications where mildly activated fluxes are too weak.
