AIM Solder to Highlight Newly Developed M8 No Clean Solder Paste at NEPCON China 2015

CRANSTON, RHODE ISLAND – March 18, 2015 - AIM Solder, a global leader in the manufacture of solder assembly materials for the electronics industry, will highlight their newly developed M8 Solder Paste at NEPCON China 2015 at the Shanghai World EXPO Exhibition & Convention Center, April 21-23, 2015 in stand A-1G74. An evolution of the highly successful NC258 platform, M8 is designed for the most demanding high-density electronic assemblies. 

Developed in combination with T4 and finer lead-free alloy powders, M8 provides stable transfer efficiencies required for today’s challenging applications. A novel activator system provides powerful, durable wetting action accommodating a wide range of profiling processes and techniques. M8 eliminates HiP defects on BGAs and reduces voiding on QFN/BTC components while producing bright shiny solder joints, leaving minimal, high purity residue engineered to be safely left in place. 

For more information about the revolutionary new M8 Solder paste and AIM’s complete line of solder products and services, including lead-free and halogen-free products and SN100C®, visit the company in stand #A-1G74 at NEPCON China or visit www.aimsolder.com.

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, visit www.aimsolder.com.

Upcoming Events:

March 23-27, 2015 – FIEE – São Paulo, Brazil

March 24, 2015 – SMTA Dallas – Plano, Texas USA

March 26, 2015 – SMTA Houston – Stafford, Texas USA

April 21-23, 2015 – Nepcon China Shanghai 2015 – Shanghai China