CRANSTON, RHODE ISLAND, U.S.A. ― AIM Solder, a leading global manufacturer of solder assembly materials and partner in the Conflict-Free Tin Initiative (CFTI), announces that David Suraski, Executive Vice President of the Assembly Materials Division of AIM Solder, will present a summary of the company’s program for the environmentally responsible procurement of raw materials, involvement in the Conflict Free Tin Initiative (CFTI), manufacture of solder paste and bar solder, recycling of returned paste and bar solder, and reduction in Pb. AIM’s presentation, A Solder Supplier’s Environmental Program - Strategy and Benefits, will be held at the SMTA Boston Chapter’s Earth Day Meeting on Tuesday April 22, 2014 at Precision Placement Machines in Fremont, New Hampshire.
David Suraski has worked for the company in a variety of roles since 1997, including technical support, marketing, operations, and as the managing director of the company's Asian business unit while based in China for 5 years. Suraski has authored and co-authored over a dozen of published articles on topics ranging from lead-free soldering to reflow profiling to conflict metals. Suraski has his B.A. from American University in Washington, D.C. and his MBA from Bryant University.
“AIM has taken major steps to direct our business in a manner that protects the environment by integrating into our policies the preservation of the environment and its natural resources,” said David Suraski, Executive Vice President, Assembly Materials Division. To learn more about AIM and the company’s commitment to environmental and social responsibility visit http://www.aimsolder.com.
For more information on this event or to register to attend visit http://www.smta.org.
About AIM
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of solder assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training.
Upcoming Events:
April 23-25, 2014 – NEPCON China Booth #A2-1E57 – Shanghai China
May 6-8, 2014 - SMT Hybrid Packaging 2014 Stand #9-232 – Nuremburg, Germany
May 21-22, 2014 - Expo Proveedor Industrial 2014 Stand #12 – Matamoros, Mexico
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