NC520 LEAD-FREE & TIN/LEAD SOLDER PASTE

Features: 
- For Use with Demanding High Density Electronic Assemblies
- Reduced Head-in-Pillow
- Extremely Stable Formula
- Extended Pause-to-Print Process Window
- Reduces Voiding on QFN Ground Pads
- Improved Printing Characteristics

 

NC520 is a general no clean paste for use with lead-free and tin/lead alloys . NC520 has been developed to offer excellent wetting, improved printing and to reduce voiding.