AIM présentera la pâte à souder de type 5 au salon NEPCON Asia et à la conférence SMTA
Cranston, Rhode Island USA. AIM Solder is pleased to announce its participation in the upcoming NEPCON Asia tradeshow and concurrent SMTA Technology Conference. This event takes place October 28-30 at Shenzhen World Exhibition & Convention Center (Baoan). As a leading global manufacturer of solder assembly materials for the electronics industry, AIM will be showcasing cutting-edge […]