美国罗德岛州克兰斯顿. AIM Solder is pleased to announce its participation in the upcoming APEX Expo 2026. APEX takes place March 17-19 at the Anaheim Convention Center in California. As a leading global manufacturer of solder assembly materials for the electronics industry, AIM will be showcasing cutting-edge soldering materials. These include the innovative REL61 合金.
AIM 将 REL61 设计为 SAC305 的直接替代品。通过减少银含量并加入少量铋，REL61 在所有指标上都能以更低的价格提供与 SAC305 相当或更好的性能。随着银价屡创新高，现在是转换产品的最佳时机。中型到大型制造商已经通过改用 REL61 每年节省了数十万美元。在十多年的生产过程中，众多电子产品制造商都采用了 REL61。该产品有棒状、实心和有芯焊线以及焊膏，适用于所有组装应用。.
Technical Conference Presentation
AIM’s Gayle Towell will be presenting at the accompanying technical conference. Her paper is titled “Rethinking Area Ratio: A Physics-Based Model for Predicting Solder Paste Transfer Efficiency for Thin Stencils”. This presentation will take place in session #17 SMT Process 2: Stencil & Print Quality on Wednesday, March 19第 from 2:00-5:30pm.
摘要 Area ratio (AR) has long been the industry standard for predicting solder paste transfer efficiency (TE) and guiding stencil aperture design. However, as electronics manufacturing pushes toward ultrafine pitches and thinner stencils, inconsistencies in TE have emerged despite AR values being above the recommended 0.60 threshold. This study examines the theoretical foundations of stencil paste release, focusing on the interplay between gravitational forces (which scale with paste volume) and adhesive forces between paste, stencil walls, and substrate (which scale with surface area).
Here, an alternative model for variable AR limits that accounts for variations in stencil thickness is proposed. To test this approach, the model was applied to pre-existing experimental data obtained from previously published papers in which print tests with differing stencil thicknesses were used. Findings indicate that a stencil-thickness-dependent AR limit provides a more accurate predictor of TE across varying stencil designs and could inform future industry standards for ultrafine solder paste printing.
To learn and more discover all of AIM’s products and services, visit the company at APEX Expo 2026 at booth #2813. You can also visit AIM anytime at visit www.aimsolder.com。
关于AIM
AIM Solder 总部位于加拿大蒙特利尔，是全球领先的电子行业组装材料制造商。AIM 的制造、分销和支持设施遍布全球，生产先进的焊料产品。这些产品包括焊膏、液体助焊剂、有芯焊丝、棒状焊料、环氧树脂、无铅和无卤焊料产品。AIM 还为各行各业提供铟和金等特种合金。作为 SMT 行业许多著名奖项的获得者，AIM 坚定地致力于产品和工艺改进的创新研发。此外，AIM 还为向客户提供卓越的技术支持、服务和培训而感到自豪。有关 AIM 先进焊料产品全线和全球技术服务的更多信息，请访问 www.aimsolder.com。