AIM Solder’s Flopy Feng to Present on Pin in Paste Soldering at SMTA South China Conference

Cranston, Rhode Island USA – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA South China Technology Conference taking place on October 11-12, 2023, at the Shenzhen World Exhibition and Convention Center in Shenzhen, China. AIM Regional Technical Support Manager, Flopy Feng, will present on the topic: Pin in Paste. 

Flopy Feng is a Technical Support Manager for AIM Solder. Having worked as a process supervisor for seven years, he is experienced in process evaluation and optimization. With over 20 years of experience in the SMT industry, Flopy supports AIM customers in South China.​ The abstract for his presentation is as follows:

Despite predictions of the demise of through-hole components, they remain commonplace throughout the industry. However, their use is in decline and assemblies may only incorporate one or two through-hole components. An alternative technique for soldering through-hole components, eliminating the need for a separate soldering process, is the Pin-in-Paste (PiP) or Intrusive Reflow method. PiP utilizes solder paste printing and the SMT reflow processes to solder through-hole devices. The PiP technique can be more cost effective by eliminating the need for a wave or selective soldering process and the associated costs. This presentation will detail the PiP process including PCB and stencil design considerations as well as solder paste selection and reflow guidelines.

Mr. Feng will deliver his presentation at the SMTA South China Technology Conference at 10:45 am on October 11. To learn more about AIM’s products and services, visit  www.aimsolder.com.

 

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service, and training. For more information about AIM’s complete line of advanced solder products and global technical services, please visit www.aimsolder.com.