DJAW-10 STENCIL CLEANER Features Compatible with all AIM solder pastes Use in place of isopropyl alcohol (IPA) Enhances paste life and performance Hand or machine apply Reduces wipe frequency Reduces aperture clogging DJAW-10 Stencil Cleaner Product Description Application Use Product Data Info Technical Documents Product Description Introducing DJAW-10, our efficient under stencil wipe solvent compatible […]
Glow Core NO CLEAN CORED SOLDER WIRE Features Fast wetting Pleasant odor Clear residue Extends solder tip life ROL0 per Current J-STD-004 Available in Sn/Pb Glow Core No Clean Flux Cored Solder Wire Product Description Application Use Product Data Info Technical Documents Product Description Glow Core is a no clean cored solder wire designed to
NC259FPA Ultrafine NO CLEAN SOLDER PASTE Features Precise print definition with Type 6 and finer solder powder Excellent Wetting High shear strength Clear flux residue Nitrogen reflow recommended Zero halogen/halogen-free 8-hour stencil life REACH and RoHS Compliant NC259FPA Ultrafine No Clean Solder Paste Product Description Application Use Product Data Info Technical Documents Product Description Solder
Epoxy 4044 SINGLE PART EPOXY Features One Part Epoxy Designed for Printing Applications Thermal Curing High Shear Strength Robust Handling Characteristics Compatible with High-Speed Placement Equipment Epoxy 4044 Product Description Application Use Product Data Info Technical Documents Product Description Epoxy 4044 is single part epoxy adhesive used for bonding SMT components to a PWB prior
Epoxy 4089 SINGLE PART EPOXY Features Developed for Dispensing Applications Robust Handling Characteristics One Part Thermal Cure Epoxy Non-Stringing Formula High Shear Strength RoHS Compliant Epoxy 4089 Product Description Application Use Product Data Info Technical Documents Product Description Epoxy 4089 is a single part, epoxy adhesive used for bonding SMT components to a PWB prior
Common Flux Thinner SOLVENT Features High Purity Extends Flux Life Improves Flux Coverage Compatible with Most Flux Classifications Common Flux Thinner Product Description Application Use Product Data Info Technical Documents Product Description Common Flux Thinner is a solvent formulated to thin water soluble, no clean and RMA fluxes in foaming and some spray applications. Application
One-Step Underfill 688 SINGLE PART EPOXY Features Excellent Capillary Action Flux and Underfill Adhesive in One Step No Voiding Odorless During Printing and Curing Non-Hygroscopic Stable Rheology RoHS Compliant One-Step Underfill 688 Product Description Application Use Product Data Info Technical Documents Product Description One-Step Underfill 688 is a low surface tension, single component epoxy resin
Underfill FF35 SINGLE PART EPOXY Features Fast Flowing Capillary Action Re-workable at 120°C No Voiding Compatible with No Clean Flux Residues Minimal Voiding Stable Rheology Favorable Storage Properties RoHS Compliant Underfill FF35 Product Description Application Use Product Data Info Technical Documents Product Description Underfill FF35 is a low surface tension, single component epoxy resin designed
Sn42/Bi58 LOW TEMPERATURE LEAD-FREE SOLDER ALLOY Features Manufactured with AIM Electropure™ Technology Good Fatigue Characteristics Improved Wetting Low Temp Alloy: Melting Point:138°C RoHS Compliant Complies with IPC J-STD-006 Sn42/Bi58 Low Temperature Alloy Product Description Application Use Product Data Info Technical Documents Product Description Sn42/Bi58 is a low melting temperature alloy composed of 42% tin, 58%
SN100C LEAD-FREE SOLDER ALLOY Features Produces Smooth, Bright Solder Joints Cost Saving Alloy Melting Point: 227°C Does Not Contain Silver Minimizes Copper Erosion from Holes, Pads and Tracks Solder Dross Rate Similar to Sn-Pb Alloys Manufactured with AIM Electropure™ Technology Complies with IPC J-STD-006 SN100C Lead-Free Solder Alloy Product Description Application Use Product Data Info
