Products

 RMA258-15R is a rosin based solder paste that has been developed to offer long pause-to-print capabilities while enhancing fine print definitions. RMA258-15R reduces such defects as voiding and eliminates head-in-pillow. The superior wetting ability of RMA258-15R results in bright, smooth and...
 M8 no clean solder paste is designed for the most demanding high density electronic assemblies. An evolution of the highly successful NC258 platform, M8 brings no clean solder paste to the next level. Developed in combination with T4 and finer mesh leaded and lead-free alloy powders,...
 Epoxy 4089 is a single component, epoxy adhesive used for bonding SMT components to a PWB for double sided reflow or wave solder assembly. Epoxy 4089 has a formulated tolerance to shear-thinning, a dot formation suitable for automated dispense equipment or positive displacement pump systems,...
 AIM’s WS488 water soluble solder paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates. WS488 offers superior slump resistance, as well as excellent print characteristics and 8+ hours of stencil life. WS488 is compatible with...
 Common Flux Thinner is a solvent that is used to thin Water Soluble, No Clean and RMA fluxes in foaming and some spray applications. 
 NC277 Liquid Flux is a water-based VOC-Free flux that has performance and reliability characteristics equal or superior to many alcohol-based fluxes. A medium-solids/residue flux, NC277 has an exceptionally durable and powerful activator system making it ideally suited for high thermal mass...
 A saponifier formulated to readily remove resin, rosin, no clean, and water soluble flux residues from printed circuit boards while preventing the attack of aluminum components and hardware common with many saponifers.
 RMA 202-25 is a medium solids, mildly activated liquid flux with a solvent rosin activation formulated to provide a post-process flux residue that is both insulating and non-hydroscopic and does not require cleaning. As a mildly activated rosin based flux, RMA 202-25 offers a wide process...
 Epoxy 4044 is a single component, epoxy adhesive used for bonding SMT components to a PWB for double sided reflow or wave solder assembly. Epoxy 4044 has a formulated tolerance to shear-thinning, a dot formation suitable for automated dispense equipment or positive displacement pump systems,...
 WS735 is an alcohol based, organically activated, water-soluble liquid flux designed specifically for wave solder applications. WS735 may be applied by automated flux sprayers, foamed, dipped, or brushed on with favorable results. WS735 is active at room temperature and maintains a wide...
 WS482 is a water soluble, halide-free flux cored wire that is highly active and compatible with water soluble solder paste chemistries. WS482 offers improved thermal stability, allowing it to be processed with standard or high temperature alloys. WS482 offers residues that are non-corrosive...
 One-Step Underfill 688 is a low surface tension, one component epoxy resin designed as a one-step no-flow underfill for flip chip, CSP, BGA and micro-BGA assemblies. One-Step Underfill 688 improves product reliability through high Tg, low CTE, and good fill with no voiding. Even though One-...
 AIMTERGE 6035 cleaner is a saponifier formulated to readily remove resin, rosin, no clean and water soluble flux residues from printed circuit boards, while preventing the attack of components and aluminum hardware common with many saponifers. The removal of water-soluble organic acid flux...
 GLOW CORE solder wire is a lead-free and tin-lead compatible no-clean flux core that offers very good wetting and low residues.  
 RMA is a mildly activated, general-purpose wire solder for use in applications requiring good activation. RMA cored wire is active enough for excellent tarnish or oxide removal, and will produce bright shiny solder joints. RMA wire will leave slight to moderate post-process residues that may...
 WS715M is a neutral alcohol based, organically activated, rosin-free, water soluble liquid flux designed specifically for wave solder applications. Though designed for application via foam fluxer, WS715M may also be applied by automated flux sprayers, dipped, or brushed on with favorable...
 Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underfill FF35 offers superior reliability...
 A solvent blend stencil cleaner with a concentrated additive that is 100% compatible with all AIM solder pastes and epoxies. 200AX is formulated for application by hand. Where automatic application is desired, AIM’s DJAW Stencil Cleaner is recommended. 
 RA-301 is a fully activated rosin-based flux formulation containing 35% solids. RA-301 has a very wide process window, which makes it an acceptable alternative to a variety of environments and process applications. RA-301 has a high activity level that provides bright, shiny solder joints and...
 NC259 is a low-cost, lead-free halogen-free solder paste that offers the performance of tin-lead and high-silver lead-free solder pastes.  Now manufacturers can attain the SMT soldering results they require and pay significantly less per gram than with traditional lead-free solder pastes...
 WS716 is a halogen- and halide-free, alcohol based, organically activated, rosin-free, water soluble liquid flux designed specifically for wave solder applications. WS716 is the liquid version of the WS-477S1 series solder paste. Though designed for application via foam fluxer, WS716 may also...
 NC258 Solder Paste has been developed to offer long pause-to-print capabilities while enhancing fine print definitions.  NC258 Solder Paste reduces defects such as voiding and head-in-pillow.  The superior wetting ability of NC258 results in bright, smooth and...
 DJAW-10 is a long chained alcohol based stencil cleaner with a concentrated additive that is 100% compatible with all AIM solder pastes. DJAW-10 is formulated for application by hand or automated dispensing equipment.
 RA is a fully activated, general-purpose wire solder for use in applications where mildly activated fluxes are too weak. RA cored wire is strong enough for excellent tarnish and oxide removal, and will produce bright shiny solder joints. RA wire will leave slight to moderate post process...
 WS770 is a PH neutral, organically activated, water-based, VOC-free water-soluble liquid flux formulated to fully atomize during the wave soldering process. WS770 may be applied by automated flux sprayers, foamed, dipped, or brushed on with favorable results. WS770 is a buffered...