AIM to Highlight H10 and Present on Low Temperature Rework at SMTA Guadalajara

Cranston, Rhode Island USA – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation in the upcoming SMTA Guadalajara Expo & Tech Forum taking place on October 25 – 26, 2023, at Expo Guadalajara in Jalisco, Mexico. In addition to highlighting their newest halogen-free no clean solder paste, H10, AIM Solder’s International Technical Applications Director, Carlos Tafoya, will be presenting on Low Temperature Rework. 

Carlos oversees the AIM Global Technical Applications group that supports customers worldwide. He joined AIM in 2005 after more than 20 years of experience in the electronics assembly manufacturing industry. The abstract for his Low Temperature Rework Presentation is as follows:

Implementation of low temperature solders has been a subject of considerable interest for many consumer electronics manufactures. Low temperature solders represent a significant material and process cost advantage over traditional silver bearing and low silver alloys. Bismuth containing alloys enables low melting temperatures, therefore, if the mission profile of an assembly tolerates the limitations of bismuth containing low temperature solders, implementation is favorable. This presentation will detail the material properties and rework considerations of using a eutectic tin-bismuth solid wire and SAC305 flux cored wire in a rework setting.

At the expo portion of the event, attendees can learn how H10 offers exceptional fine feature printing, improved electrochemical reliability, and powerful wetting characteristics that eliminate NWO (HiP) defects while providing improved pad coverage on all surface finishes. H10 solder paste is capable of transfer efficiency >90% on area ratios of 0.50 and a stencil life >8 hours. It also reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical reliability on all low stand-off devices. Fit for automotive, LED and aerospace assemblies, H10 no clean solder paste is robust, stable, and easy to implement.

To discover all of AIM’s products and services, visit the company at SMTA Guadalajara Expo & Tech Forum taking place on October 25-26 for more information and to speak with one of AIM’s knowledgeable staff members, or visit www.aimsolder.com.

 

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service, and training. For more information about AIM’s complete line of advanced solder products and global technical services, please visit www.aimsolder.com.