Solder Paste

AIM’s complete line of solder pastes has been developed to deliver robust performance, ease of use and cost effectiveness. AIM halogen-free, lead-free solder pastes resolve difficult issues including QFN voiding, low area ratio printing, and high reliability requirements for LED, automotive, and military applications.

AIM solder pastes are available in no clean, water soluble, and RMA formulations for printing, dispensing, and jetting applications. AIM REL22TM offers unsurpassed thermal cycling and mechanical reliability while AIM REL61TM improves wetting and voiding performance at a lower cost than SAC305. In addition to the REL alloys AIM offers solder pastes in SN100C®, SAC305, Low Temperature and High Temperature, REACH and RoHS compliant formulas.

AIM produces a full line of complimentary products including liquid flux and wire solder to satisfy Class 3 high reliability requirements including automotive, military, telecommunication, and medical applications.

 M8 no clean solder paste is designed for the most demanding high density electronic assemblies. An evolution of the highly successful NC258 platform, M8 brings no clean solder paste to the next level. Developed in combination with T4 and finer mesh leaded and lead-free alloy powders,...
 AIM’s J8 No Clean Jetting Solder Paste is specially formulated for use with jetting equipment providing consistent solder deposits as small as 200μm. J8 is fully compatible with all AIM no clean solder pastes for use in applications where combining jetted paste deposits with printed...
 The revolutionary activator system in AIM's new NC273LT low temperature solder paste improves the wetting performance of bismuth alloys to RoHS compliant plating and surface finishes, while ensuring long stencil life, excellent transfer efficiencies and minimizes solder balling common to...
 NC257MD solder paste has been specifically designed for the MyData MY500 Jet Printer. Its unique rheological properties were engineered and validated through extensive testing to provide continuous and consistent deposits. 
 RMA258-15R is a rosin based solder paste that has been developed to offer long pause-to-print capabilities while enhancing fine print definitions. RMA258-15R reduces such defects as voiding and eliminates head-in-pillow. The superior wetting ability of RMA258-15R results in bright, smooth and...
 AIM’s WS488 water soluble solder paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates. WS488 offers superior slump resistance, as well as excellent print characteristics and 8+ hours of stencil life. WS488 is compatible with...