AIM Alloys & Bar Solder

Optimized & Industry-ready Solutions

AIM Solder Alloys

AIM Solder provides high quality alloys and complimentary materials to the electronics industry. AIM’s variety of solder alloys provide solutions for issues commonly found within the SMT assembly industry.

Zero defect wave soldering requires consistent solder quality. Contaminants and high oxide levels in bar solder can result in a variety of wave soldering defects such as bridging, projections, and poor wetting. To avoid these issues, AIM products are produced using AIM’s proprietary ElectropureTM process to produce a high-purity product exceeding IPC, JEDEC and IEC requirements.

AIM Electropure™ bar solder is processed from high-quality, virgin metals in a proprietary method that removes contaminants and reduces dissolved oxides. AIM’s Electropure™ technique results in an extremely pure, low-drossing solder bar that increases throughput and decreases defects. 

AIM’s solder alloys are engineered to be compatible with a variety of PCB assembly products including solder paste, solder wire, and flux. 

Dross Comparison of AIM Electropure Bar vs. Competitors

500 pounds of each type of alloy was heated in a wave solder pot at 500°F for 6 hours. The pot was de-drossed every 3 hours. After 6 hours the amount of dross generated from each type of solder was weighed. AIM’s bar solder has proven to reduce drossing as compared to competitive brands.

Dross Comparison of AIM Electropure Bar vs. Competitors

500 pounds of each type of alloy was heated in a wave solder pot at 500°F for 6 hours. The pot was de-drossed every 3 hours. After 6 hours the amount of dross generated from each type of solder was weighed. AIM’s bar solder has proven to reduce drossing as compared to competitive brands.

Solder Alloy Selection Guide:

AIM offers a broad range of alloys for SMT, wave soldering, hand soldering, and various applications. Commonly used alloys for the electronics industry are shown below. *Other alloys and solder forms are available upon request.

Alloy Melting Point °C Product Attributes Solder Form Availability*
Solder Paste Bar Solder Cored Wire Solid Wire
LOW TEMPERATURE
Sn42/Bi58 138 For low temperature soldering applications. Alloys containing high amount of bismuth have unique properties that may require special considerations.
Sn42/Bi57/Ag1
Sn63/Pb37 183 Not RoHS/REACH compliant.
HIGH RELIABILITY
REL22™ 210-212 High reliability, high strength lead-free solder alloy. Exceptionally durable for extreme service environments.
CASTIN® 217-219 Improved drop-shock performance versus SAC305.
TIN-SILVER/TIN-SILVER-COPPER (SAC)
SAC305 217-220 Industry standard for SMT and through hole soldering. High purity and high performance alloy.
LOW/NO SILVER LEAD-FREE
REL61™ 208-215 Enhanced reliability, high strength/low silver, lead-free solder alloy. Exhibits good wetting. Mitigates tin whisker formation.
SAC0307 217-227 Cost effective alternative to SAC alloys. Primarily used in wave, selective and hand soldering due to higher melting temperatures. High purity and high performance alloy
SN100C 227 Near eutectic, low/no silver, cost effective alternative for wave soldering and hand soldering applications.
Sn99.3/Cu0.7

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