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AIM Solder Technical Articles
AIM Solder’s collection of technical articles provide insights, details, data, and studies on a wide variety of industry-pertinent topics, including alloy innovations, how to minimize voiding, rework bench chemistry, printing adjustments, and more.
Comparative Analasys of Automated Optical Inspection (AOI) Performance With Different Solder Alloys
This paper presents a comparative study on the performance of Automated Optical Inspection (AOI) systems when applied to printed circuit boards (PCBs) soldered with SAC305 and a third-generation, low-silver, bismuth-containing ...
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Rethinking Area Ratio: A Physics-Based Model for Predicting Solder Paste Transfer Efficiency for Thin Stencils
Area ratio (AR) has long been the industry standard for predicting solder paste transfer efficiency (TE) and guiding stencil aperture design. However, as electronics manufacturing pushes toward ultrafine pitches and ...
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Ensuring Optimal Performance of Solder Paste in Challenging Environments
Solder paste is an elaborate mixture of metal powders, acids, thixotropes, solvents and a variety of other chemicals. When combined, the reactions and interactions can be extremely varied and complex. When designing solder ...
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When Do You Need Nitrogen In Reflow?
Nitrogen in reflow soldering is often seen as a performance enhancer—offering improved wetting, shinier joints, and fewer defects. But it’s not always necessary. While nitrogen can deliver real process benefits, ...
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Understanding Solder Dross: Causes and Control Strategies
A common question from manufacturing teams is: How much dross is normal? The reality is that there is no universal benchmark. Drossing rates are influenced by a combination of factors ...
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