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High reliability 焊膏 withstand extreme conditions, ensuring that electronic components hold together securely over time. However, the conversation around these pastes frequently centers almost exclusively on their reliability, overshadowing equally crucial performance metrics such as wetting, voiding, and printability.   

This article shifts the lens, arguing for a more comprehensive approach to developing and evaluating solder pastes. One where high reliability is balanced with superior performance across all relevant dimensions. 

When a paste excels in reliability but falls short in other areas, it can lead to increased rework and higher scrap rates. The consequences are not merely technical but also economic.   

Rework—correcting poor solder joints, bridging, or other defects—consumes valuable time and resources, significantly impacting production timelines and operational efficiency. The scrap rate, a direct measure of wasted materials, further inflates costs.   

The true cost of rework and scrap also includes lost productivity, delayed product deliveries, and even reputational damage. In sectors such as aerospace, 汽车, and medical devices, reliability is non-negotiable. Here, the failure to meet stringent quality standards can have dire consequences. This underscores the need for solder pastes that perform reliably across all metrics. 

Developing solder pastes that meet these comprehensive performance criteria requires a rigorous approach. That’s why we have a state-of-the-art applications lab to replicate real-world manufacturing environments. This hands-on, empirical methodology ensures that products are not only theoretically sound but practically effective.  

This approach also allows us to fine tune paste formulations. We can reduce voiding in complex assemblies, enhance wetting on various substrates, and ensure consistent printability across a wide range of processes. 

REL22^TM is a high reliability alloy developed to withstand the most extreme environments. Designed to address a balance between minimal voiding, superior wetting, and excellent printability, alongside enduring mechanical strength, and thermal resilience.   

 REL22^TM distinguishes itself from other high reliability alloys with a suite of features tailored for the most demanding applications:    

• A Wider 装配工艺窗口: REL22^TM is versatile, accommodating a broader range of assembly processes and conditions.    

• Significantly Less Voiding: REL22^TM has demonstrated a remarkable reduction in voiding, a critical factor in enhancing the longevity and reliability of electronic assemblies.  

• Faster and Stronger Wetting: The alloy’s composition ensures quick and robust wetting, crucial for forming strong, reliable solder joints.  

• Enhanced Tensile Strength: Both in its cast form and after aging, REL22^TM remains strong and capable of withstanding mechanical stress over time.    

• Lower Creep Rates: Its formulation is optimized to exhibit lower creep rates, essential for maintaining joint integrity under thermal stress.  

• Superior Thermal Cycling Performance: REL22^TM excels in thermal cycling, showcasing its ability to endure the rigors of repeated thermal excursions without degradation in performance.  

While we’ve proven REL22^TM ‘s performance in our own labs multiple times over, it has also been validated by third-party testing. This additional testing provides our customers with confidence and confirmation that this product will meet their needs. Organizations like DfR, Auburn University, Cree Lighting, and Rockwell Collins have all conducted studies comparing REL22^TM to other pastes. 

 What follows are just some of the results from such tests: 

The following images demonstrate REL22^TM‘s superior voiding performance compared to a competitor high reliability paste.  

In thermal shock testing, REL22^TM significantly outperformed multiple competitor SAC305 and high reliability solders with a pass percentage of 98.53% compared to results ranging from 80.14-94.65%.  

Reliability is just one facet of performance. Modern electronics manufacturing demands materials that not only withstand harsh conditions but do so without compromising on wetting, voiding, printability, and overall assembly efficiency. A holistic approach to solder paste performance is not a luxury but a necessity, given the economic and reputational stakes involved. 

AIM Solder’s REL22^TM has been recognized several times over, not just by third party testers and customers, but by the industry at large. It even received Circuits Assembly’s New Product Introduction (NPI) Award in 2018 at the IPC APEX convention.  

Discover more about REL22^TM and how AIM Solder’s commitment to innovation and quality can support your manufacturing goals. Together, let’s redefine what it means to be “high reliability” in the soldering industry.