7. August 2024

AIM präsentiert NC259FPA Ultrafine No Clean Solder Paste auf der SMTA Ohio Valley Expo & Tech Forum  

Cranston, Rhode Island USA – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Michigan Expo & Tech Forum taking place on August 29 at the Embassy Suites by Hilton Cleveland-Rockside in Independence, Ohio. Among other great products, AIM will […]

AIM präsentiert NC259FPA Ultrafine No Clean Solder Paste auf der SMTA Ohio Valley Expo & Tech Forum   Mehr lesen "

AIM präsentiert NC259FPA Ultrafine No Clean Solder Paste auf der SMTA Michigan Expo & Tech Forum  

Cranston, Rhode Island USA – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Michigan Expo & Tech Forum taking place on August 27 at Laurel Manor in Livonia, Michigan. Among other great products, AIM will be highlighting its recently

AIM präsentiert NC259FPA Ultrafine No Clean Solder Paste auf der SMTA Michigan Expo & Tech Forum   Mehr lesen "