Cranston, Rhode Island USA. AIM Solder is pleased to announce its participation in the upcoming NEPCON Asia tradeshow and concurrent SMTA Technology Conference. This event takes place October 28-30 at Shenzhen World Exhibition & Convention Center (Baoan). As a leading global manufacturer of solder assembly materials for the electronics industry, AIM will be showcasing cutting-edge soldering materials. These include Type 5 solder paste offerings as well as finer solder paste solutions.
In celebration of emerging trends in electronics miniaturization, AIM has declared 2025 the “Year of Type 5.” AIM’s decades of experience producing high-quality solder pastes makes the company uniquely positioned to guide customers through the transition to finer powders. In addition, AIM develops products with a focus on consistency, reliability, and process optimization coupled with robust technical support. While Type 5 solder paste won’t replace Type 4 as the industry standard this year, its adoption is accelerating. Learn how demand for precise and consistent soldering is driving this trend.
In addition, Diego Jiang, Product Manager for AIM Solder China, will be presenting on “The Effect of Under-Stencil Wipe Chemistry on Solder Printing”. This presentation is part of the concurrent SMTA China South Technology Conference. This conference takes place October 28, 10:00am – 4:00pm.
Abstract: Understanding the effects of under-stencil wipe chemistry is crucial for achieving optimal print performance in Surface Mount Technology (SMT). However, lab testing often may not correlate with field results. Production settings often introduce variables that are challenging to reproduce in a lab environment. This study approximates a production environment in a multi-hour printing test. To quantify the effect of under-stencil wipe solvent on solder paste performance, the study compares common isopropyl alcohol (IPA) with a novel stencil cleaner.
To learn more about AIM’s solder paste offerings and to discover all of AIM’s products and services, visit the company at NEPCON Asia at booth 13A40, or visit www.aimsolder.com.
About AIM
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry. With manufacturing, distribution and support facilities located throughout the world, AIM produces advanced solder products. These include solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products. AIM also offers specialty alloys such as indium and gold for a broad range of industries. As a recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement. Moreover, AIM prides itself in providing customers with superior technical support, service, and training. For more information about AIM’s complete line of advanced solder products and global technical services, please visit www.aimsolder.com.