No Clean

AIM’s full line of no clean solder products includes solder pastes, liquid fluxes and cored wire solders. These products have been proven to provide excellent soldering results to the end user, with post-process residues safe to leave on most assemblies, including high-reliability and RF devices.

 M8 no clean solder paste is designed for the most demanding high density electronic assemblies. An evolution of the highly successful NC258 platform, M8 brings no clean solder paste to the next level. Developed in combination with T4 and finer mesh leaded and lead-free alloy powders,...
 FX16 No Clean Flux has been engineered to provide exceptional soldering performance while leaving minimal, electrically safe flux residues, even when unheated. FX16 is ideally formulated for point-to-point selective soldering and palletized wave soldering. FX16 provides...
 AIM’s J8 No Clean Jetting Solder Paste is specially formulated for use with jetting equipment providing consistent solder deposits as small as 200μm. J8 is fully compatible with all AIM no clean solder pastes for use in applications where combining jetted paste deposits with printed...
 GLOW CORE solder wire is a lead-free and tin-lead compatible no-clean flux core that offers very good wetting and low residues.  
 NC257MD solder paste has been specifically designed for the MyData MY500 Jet Printer. Its unique rheological properties were engineered and validated through extensive testing to provide continuous and consistent deposits. 
 IPA-based flux for foaming or spraying applications. 
 NC280 is a low-to-medium solids, no-clean liquid flux formulated to leave minimal post-process residues that are pin testable without cleaning.  NC280 offers an excellent activity level with good performance on bare copper, solder coated and organic coated PWBs, leaving negligible...
 NC Paste Flux is a no clean tacky/rework flux designed to wet virtually all solderable electronic surfaces, components, assemblies, and substrates. AIM NC Paste Flux may be used for general touch up or rework of printed circuit boards, and for attaching spheres to ball grid array (BGA)...