Insights from ECTC 2025: Advanced Packaging, AI, and the Evolving Role of Solder
By Gayle Towell I recently attended the 75th annual Electronic Components and Technology Conference (ECTC) at the end of May. The conference brought together a record number of attendees and technical presentations. It also highlighted the rapid evolution of chip-scale packaging in the AI era. With more than 2,500 participants and nearly 800 technical submissions, […]
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