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Solder paste being applied via squeegee

How to Stay Within the SMT Assembly Process Window

by Kevin Pigeon Understanding and controlling the assembly process window is not just about managing the solder paste. It’s about mastering all process variables across the entire SMT assembly process for optimal outcomes.  Defining the Assembly Process Window  The assembly process window defines the range of parameters within which solder paste will meet optimal performance […]

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Ultrafine Solder Paste Printing in Electronics Manufacturing

As the electronics industry pushes the boundaries of miniaturization, the precision of solder paste printing has taken center stage in the manufacturing process. This evolution demands not only meticulous technique, but a deep understanding of ultrafine solder paste properties.   Drawing on the knowledge of our process engineers, metallurgists, and chemists, this article aims to provide

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Alloy Evolution: The Path from SAC305 to High-Reliability 

As industry needs evolved, so did solder alloys, addressing specific performance requirements and setting new benchmarks. This article embarks on a chronological exploration of this alloy evolution journey, highlighting pivotal developments and the future trajectory of solder alloy innovation.  Historically, the introduction of regulations like RoHS (Restriction of Hazardous Substances) prompted a shift away from

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Maximize Value and Sustainability with AIM’s Solder Reclaim 

In the rapidly evolving electronics industry, managing waste, particularly solder waste, has become a critical environmental and economic challenge. AIM Solder recognizes the significance of this issue, which is why we provide solder Reclaim Services as part of our “cradle-to-grave” ethos. This service not only addresses environmental concerns but also provides a cost-effective solution for

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