AIM Specialty Materials Division
Solders for Photonic Packaging
Specialty Materials Division
Solders for Photonic Packaging
AIM’s wide range of specialty joining materials includes indium, gold/tin, bismuth, cadmium and gallium based solder alloys for photonic packaging applications.
When you work with AIM you receive superior products & the technical support you need to produce innovative and reliable packaging solutions. AIM offers a broad range of solders to fulfill the most unique and challenging component packaging applications. We offer solders for:
- Fiber to Ferrule Soldering
- Laser Die Attach
- Hermetic Packaging & Sealing
- Wetting & Sealing Laser Optics
- Thermal Management
For further information contact AIM’s Specialty Materials Department.
AIM’s Commonly Specified Solder Alloys Used in Photonic Packaging Applications
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