AIM Solder to Present at Step-by-Step New Technologies Conference Suzhou
AIM Solder to Present at Step-by-Step New Technologies Conference Suzhou Read More »
May 18, 2026
When Physics Meets the Production Floor: An Award-Winning Stencil Insight
by Gayle Towell I am proud to share that my recent APEX EXPO technical paper, “Rethinking Area Ratio: A Physics-Based Model for Predicting Solder Paste Transfer Efficiency for Thin Stencils,” received the NextGen Best Paper Award. I am furthermore grateful to AIM for giving me the support, encouragement, and room to pursue the kind of
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