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AIM Solder Technical Articles
AIM Solder’s collection of technical articles provide insights, details, data, and studies on a wide variety of industry-pertinent topics, including alloy innovations, how to minimize voiding, rework bench chemistry, printing adjustments, and more.
The Role of Solder in Advanced Semiconductor Packaging
A critical aspect of semiconductor fabrication involves the encapsulation of integrated circuits to protect them from physical damage and corrosion, while enhancing their performance and reducing size. The technology around ...
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Solder Paste Powder: When to Downsize
As components shrink in size, the demand for finer solder pastes increases. But the selection of solder paste is not just about matching component size, it’s also about optimizing printing ...
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Improving Solder Paste Printing With Squircle Aperture Designs
The squircle combines the volumetric benefit of square apertures with the paste release benefits of rounded shapes, which also avoids regions of paste accumulation. It brings the best of both ...
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Significant Reduction in QFN Voids with I/O Pad Overprinting
This technical article explores an unconventional yet promising technique for reducing QFN voiding in surface mount technology (SMT) manufacturing.
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Pin-in-Paste (PIP) Assembly
An alternative technique for soldering through-hole components, eliminating the need for a separate soldering process, is the Pin-in-Paste (PiP) or Intrusive Reflow method. PiP utilizes solder paste printing and the ...
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