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All
- All
- Solder Alloys
- Solder Reclaim
- Ultrafine Solder Paste

Blog
AIM’s REL61 Solder Alloy
This article explores REL61’s place in the evolution of lead-free solder, the unique advantages of its bismuth-enhanced formulation, and its performance compared to widely used alternatives like SAC305.
December 11, 2024
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Blog
All About Tin: Sourcing, Soldering, and Sustainability
Tin, with its rich history spanning ancient civilizations to modern electronics, remains an integral metal in soldering. In this post, we explore tin's journey—from historical significance to global market, sourcing, ...
December 2, 2024
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Blog
Preventing Electrochemical Contamination at the Rework Station
Although the rework bench plays a critical role in electronics manufacturing, engineers often overlook its cleanliness due to its lack of flashy machinery and perceived simplicity.
November 14, 2024
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Blog
How to Stay Within the SMT Assembly Process Window
Understanding and controlling the assembly process window is not just about managing the solder paste. It’s about mastering all process variables across the entire SMT assembly process for optimal outcomes.
November 4, 2024
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Blog
Ultrafine Solder Paste Printing in Electronics Manufacturing
As the electronics industry pushes the boundaries of miniaturization, the precision of solder paste printing has taken center stage in the manufacturing process. This evolution demands not only meticulous technique, ...
October 11, 2024
Ultrafine Solder Paste
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