STAY UPDATED

Articles &
White Papers

Your Global Leader in Solder Technology

AIM Solder Technical Articles

AIM Solder’s collection of technical articles provide insights, details, data, and studies on a wide variety of industry-pertinent topics, including alloy innovations, how to minimize voiding, rework bench chemistry, printing adjustments, and more. 

Systematic Troubleshooting in Electronics Assembly: A Case Study in Solder Balling and Process Optimization 

Manufacturing defects in surface mount technology (SMT) assembly can be persistent and difficult to diagnose without a structured troubleshooting approach. When a contract assembler encountered recurring solder balling on a ...
Read Full Article

Solder Paste Dispensing in PCB Assembly

While stencil printing has long been the cornerstone of applying solder paste, it faces limitations with extremely small or large components. This challenge underscores the need for adaptable and innovative ...
Read Full Article

Solder Paste Printing Performance: Comparing Coated Stencils vs Uncoated Stencils

by Timothy O’Neill In a recent study focused on optimizing solder paste transfer efficiency, the initial phase used factory applied coated stencils to isolate and understand the effects of solder ...
Read Full Article

Understanding Solder Paste Viscosity and Thixotropy

Viscosity is a measure of a fluid's resistance to flow. Think of it as a fluid's "thickness" or "thinness." A fluid that flows slowly, like molasses, has a high viscosity, ...
Read Full Article

Conformal Coating Over No Clean Flux

This study evaluates the performance of various types of conformal coating over no clean flux residues left after soldering.
Read Full Article

Subscribe to our newsletter

Don't miss new updates from AIM Solder.