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AIM Solder Technical Articles
AIM Solder’s collection of technical articles provide insights, details, data, and studies on a wide variety of industry-pertinent topics, including alloy innovations, how to minimize voiding, rework bench chemistry, printing adjustments, and more.
Bismuth in Solder Alloys: From Bulk Constituent in Low Temp to Performance Enhancer in High-Reliability
In recent years, bismuth has emerged as an advantageous alloying element in solder, serving two key applications. First, bismuth is used in many low-temperature solders that support temperature-sensitive assemblies, and ...
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Investigating Intermittent Soldering Defects
The PCB assembly process creates millions of solder joints with great precision, which is why intermittent soldering defects can be particularly frustrating. It is common to assume that soldering materials, ...
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Preserving Solder Paste Integrity: A Closer Look at Mixing Methods and Automated Mixers
While automation in manufacturing brings efficiency and consistency, the use of automated solder paste mixers is a topic of debate, with significant concerns over their impact on the paste's properties. ...
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Identifying Solder Mask Problems with Simple Tests
In printed circuit board (PCB) assembly, solder mask integrity is paramount. This protective layer, designed to shield the copper surfaces and prevent solder bridging between components, plays a crucial role ...
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Reflow Profiling in Soldering and PCB Assembly
Verifying and optimizing the temperature profile of a reflow oven ensures an ideal thermal environment for solder paste to melt, flow, and solidify, forming robust solder joints.
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