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AIM Solder Technical Articles
AIM Solder’s collection of technical articles provide insights, details, data, and studies on a wide variety of industry-pertinent topics, including alloy innovations, how to minimize voiding, rework bench chemistry, printing adjustments, and more.
Systematic Troubleshooting in Electronics Assembly: A Case Study in Solder Balling and Process Optimization
Manufacturing defects in surface mount technology (SMT) assembly can be persistent and difficult to diagnose without a structured troubleshooting approach. When a contract assembler encountered recurring solder balling on a ...
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Solder Paste Dispensing in PCB Assembly
While stencil printing has long been the cornerstone of applying solder paste, it faces limitations with extremely small or large components. This challenge underscores the need for adaptable and innovative ...
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Solder Paste Printing Performance: Comparing Coated Stencils vs Uncoated Stencils
by Timothy O’Neill In a recent study focused on optimizing solder paste transfer efficiency, the initial phase used factory applied coated stencils to isolate and understand the effects of solder ...
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Understanding Solder Paste Viscosity and Thixotropy
Viscosity is a measure of a fluid's resistance to flow. Think of it as a fluid's "thickness" or "thinness." A fluid that flows slowly, like molasses, has a high viscosity, ...
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Conformal Coating Over No Clean Flux
This study evaluates the performance of various types of conformal coating over no clean flux residues left after soldering.
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